After releasing a range of Zenfone 2 handsets in 2015, the Taiwanese multinational ASUS has already started working on Zenfone 3 lineup.
Recently, unofficial renders were brought to the surface by Red Dot 21. The leaked renders have revealed quite a bit about the build and layout of the ASUS Zenfone 3 and Zenfone 3 Deluxe smartphones.
The surfaced renders of the ASUS Zenfone 3 hints at a metal chassis, 2.5D rear as well as front design. The power button is located at the rear with fingerprint sensor mounted in it.
A port for USB Type C is also showcased in the leaked render. Notably, the selfie clicker will be aided by an LED flash.
The second leaked render is allegedly the ASUS Zenefone 3 Deluxe variant featuring a full metal design and a frontal home button, that may or may not feature a fingerprint sensor.
The layout has revealed that channeling the Gionee S8 design, Asus had ditched the conventional antenna bands.
As far as the other specs of the forthcoming handsets are concerned, Zenfone 3 is expected to come with a 5.9-inch HD display with 720p screen resolution.
The smartphone is said to be fueled by Qualcomm Snapdragon 615 octa-core SoC working at 1.5GHz coupled with 3GB of RAM and 32GB internal storage on board.
For camera, ASUS Zenfone 3 is rumored to sport 13MP back camera along with 5MP selfie clicker and it will run on Android Marshmallow 6.0 out of the box.
The Deluxe variant, on the other hand, is expected to feature 5.5-inch full HD display with 1080p screen resolution.
The device is speculated to be powered by Qualcomm Snapdragon 650 Hexa-core processor clocked at 1.7GHz coupled with 3GB of RAM and 32GB internal memory and it will also run on Android Marshmallow 6.0.
Asus Zenfone 3 has been featured in silver, gold and black color choices. The Taiwanese company is expected to formally launch both these smartphones during the Computex 2016, a 5-day exhibition to be held in Teipei from 31st May till 4th June.